CoWoS是台积电用于先进芯片的封装技术，可将运算芯片与高带宽内存（HBM）等组件通过硅中介层整合在同一封装中。随着AI加速器需求扩大，先进封装订单增加，需求也从AI GPU扩展到服务器CPU和客制化ASIC，供应链未交订单持续累积。
封装和测试都面临产能压力。供应链消息称，相关设备交期已从过去的3至6个月延长至6至8个月，客户更优先确保交货，不再像往年一样要求台积电设备采购降价或追加功能。另据野村证券估算，英伟达Blackwell芯片的最终测试耗时约为Hopper的4倍，下一代Rubin可能达到7倍；这属于分析师估算，也意味着测试环节可能进一步挤压产能。
除了CoWoS封装报价，台湾媒体此前还报道称，台积电计划自2027年1月起上调晶圆代工价格约3%至6%，其中2纳米和3纳米等先进制程涨幅较高。这同样来自供应链消息，台积电没有公开确认具体涨价幅度。
台积电近期法说会表示，AI相关需求强劲，公司正加快扩充产能；5倍光罩面积的CoWoS封装已进入量产，并在开发更大尺寸方案，同时推进CoPoS技术。GlobalFoundries则已与台积电签署多年期、金额20亿美元的制造协议，将在纽约州工厂为台积电CoWoS供应链生产硅中介层，预计2028年上半年开始爬坡量产，短期内难以缓解当前瓶颈。
若涨价最终落实，直接承受影响的主要是采用CoWoS的AI加速器和数据中心芯片。游戏显卡通常不使用这类封装，因此不会直接受到CoWoS报价上涨影响；不过，晶圆代工价格上调仍可能逐步传导至其他芯片和终端产品
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CoWos is a containment technique for advanced chips that integrates components such as operating chips with high bandwidth memory (HBM) through a silicon intermediate layer. As the demand for AI accelerators expands, advanced encapsulation orders increase, and demand expands from AI GPU to the server CPU and customized ASI, the supply chain has accumulated.
Covering and testing are under capacity pressure. Supply chain information indicates that the delivery period for the equipment in question has been extended from three to six months to six to eight months, and that clients give higher priority to ensuring delivery and no longer require lower prices or additional functionalities for the procurement of desk power equipment as in previous years. It is also estimated by Nomura securities that the final test of the Blackwell chip in Weidar is approximately four times as long as Hopper, and that the next generation of Rubin is likely to reach seven times; this is an analyst ' s estimate, which also means that the testing chain may further squeeze capacity.
In addition to the CoWoS sealed offer, the Taiwan media had previously reported that the billing for power generation had been revised upwards by about 3 to 6 per cent since January 2027, with a higher increase in advanced production processes such as 2 and 3 nanometres. This is also the result of supply chain news, where the amount of electricity accumulated is not publicly confirmed.
The short-term approach to power generation suggests that the demand for AI is strong and that the company is accelerating the expansion of its capacity; the five-fold-mass-covered CoWos seal is already in production and is developing a larger-scale programme, while advancing the CoPoS technology. GlobalFoundries, for its part, has signed a multi-year, $2 billion manufacturing agreement with the build-up power, which will produce a silicon intermediate layer for the COWOS supply chain at the New York State plant, and is expected to start climbing in the first half of 2028, making it difficult to mitigate current bottlenecks in the short term.
If the price increases are finally realized, the main direct impact will be on the use of the CoWos' AI accelerator and data centre chips. Game GPU does not normally use this type of seal and is therefore not directly affected by the CoWoS price increase; however, the price increase for the crystal circle is still likely to gradually transfer to other chips and end products.
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